发明名称 ARRANGEMENT FOR TRANSFERRING STRUCTURES
摘要 The invention relates to an arrangement for transferring structures to a layer that is to be structured. The inventive arrangement comprises a radioparent layer and a non-radioparent layer, whereby said radioparent layer has one or several structural openings, the shape of which is adapted to the transferring structure. The inventive arrangement is characterised in that a frame opening encompassing the structural openings is also provided.
申请公布号 WO9910777(A1) 申请公布日期 1999.03.04
申请号 WO1998DE02455 申请日期 1998.08.21
申请人 SIEMENS AKTIENGESELLSCHAFT;BERGER, WILLI;HAY, BERND;HOCHMUTH, JUERGEN;GOEDL, GERNOT;GUSSMANN, VIKTOR;SCHAAFHAUSEN, JOCHEN;SPIERER, HELGE;STRUCK, THOMAS 发明人 BERGER, WILLI;HAY, BERND;HOCHMUTH, JUERGEN;GOEDL, GERNOT;GUSSMANN, VIKTOR;SCHAAFHAUSEN, JOCHEN;SPIERER, HELGE;STRUCK, THOMAS
分类号 G03F1/00 主分类号 G03F1/00
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