发明名称 INFRARED EMISSIVE MODULE
摘要 <p>A flexible infrared emissive module comprises an electrically insulating carrier layer (12), an electrically conductive layer (14) mounted to the carrier layer (12), an electrically insulating top layer (18) mounted to the carrier layer (12) and electrically conductive layers (24, 26) mounted to the other side of the carrier layer (12). The electrically conductive layer (14) comprises a fibrous composite of a fluoroelastomer and carbon</p>
申请公布号 WO1999010914(A1) 申请公布日期 1999.03.04
申请号 US1998017933 申请日期 1998.08.28
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