Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat

摘要

The invention concerns a method for connecting electronic components (2) with a carrier substrate (1), whereby at least a chip provided with signal-conducting solder bumps (10) is welded to contact surfaces (7) of the carrier substrate in a refusion soldering station. Between the carrier substrate and the component are located other solder bumps (11) isolated from the signal-conducting parts, and used as spacing elements for maintaining the component at a predetermined distance with respect to the carrier substrate, during the refusion soldering. In order to simplify the production and reduce the costs thereof, the soldering paste (11) for producing the solder bumps forming the spacing elements is applied directly on the carrier substrate, and then a chip provided with signal-conducting solder bumps is positioned on the carrier substrate such that the chip surface facing the latter is opposite the soldering paste on said substrate, and that during the subsequent refusion step, the component is soldered to the carrier substrate.