发明名称 |
Plasma enhanced OMCVD of thin film coating for polymeric fibers |
摘要 |
A plasma enhanced chemical vapor deposition process for depositing a titanium nitride film on a polymeric substrate is provided, the process including placing the polymeric substrate within a chemical vapor deposition chamber evacuated to a pressure within a range of from about 0.1 Torr to about 10 Torr, heating the polymeric substrate to a temperature within a range of from about 150 DEG C. to about 250 DEG C., introducing a vaporized organometallic compound and ammonia gas into the chamber, generating a plasma within the chamber, and, maintaining the polymeric substrate within the chamber for a time sufficient for a layer of titanium nitride to deposit upon the polymeric substrate.
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申请公布号 |
US5876808(A) |
申请公布日期 |
1999.03.02 |
申请号 |
US19970816321 |
申请日期 |
1997.03.13 |
申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
HALL, LAUREN A.;DEVLIN, DAVID J.;SMITH, DAVID C. |
分类号 |
C23C16/34;D06M10/02;D06M10/06;D06M10/08;D06M11/58;(IPC1-7):H05H1/20;H05H1/30 |
主分类号 |
C23C16/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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