| 摘要 |
A glass-ceramic composite which has forsterite in an amount of 40 to 60% by weight is included in crystallized glass having a coefficient of thermal expansion of 100 DEG to 200x10-7/ DEG C. is used to configure a package, to the electrode pads of which a quartz crystal is directly soldered, without any supporting material. A quartz crystal piece is included within a flat package that use a glass-ceramic composite according to the present invention, thereby greatly limiting the variation in resonance characteristics with respect to heat treating done when the package is sealed, as compared to previous packages.
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