发明名称 |
CHUCK WHEEL MECHANISM FOR WORKPIECE, POLISHING DEVICE, AND CLEANING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To make the draft generated in the rotation flow in the specified direction. SOLUTION: In a device, a plurality of arms 11 are radially projected from a rotational driving shaft 10, and a semiconductor wafer wf is turned by gripping the outer periphery by chuck parts 13 respectively provided on the arms 11. The arms 11 and the chuck parts 13 are formed into such a profile as to generate the down flow in which the draft to be generated in turning of the arms 11 is sucked from the outside of a chuck wheel mechanism to the rotational center side through the chuck parts 13. |
申请公布号 |
JPH1158226(A) |
申请公布日期 |
1999.03.02 |
申请号 |
JP19970237759 |
申请日期 |
1997.08.18 |
申请人 |
EBARA CORP |
发明人 |
YOSHIDA MASAO;ATO KOJI;OIKAWA FUMITOSHI |
分类号 |
B24B37/04;B24B37/30;H01L21/304 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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