| 摘要 |
An apparatus and method for connecting and interconnecting spherical ICs. The apparatus includes an enclosure which is used to hold and secure one or more spherical ICs or to connect to a device such as a printed circuit board. The enclosure includes two groups of electrical contact points. These contact points may be solder bumps, pads, leads, or any other type of connector. One group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the first spherical shaped IC and the other group of contact points on the enclosure aligns and connects with a corresponding set of contact points on the other device. The two groups of enclosure contact points are interconnected with each other through a circuit located inside the enclosure. As a result, alignment is no longer required by the contact points on the spherical shaped IC and the other device.
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