发明名称 SUBSTRATE FOR PLASTER
摘要 PROBLEM TO BE SOLVED: To obtain the subject substrate exhibiting excellent application operability and applied feeling and capable of decreasing the generation of fiber scraps in case of half-cutting by laminating a resin film layer on a specific nonwoven fabric in such a manner as to get an impregnation depth of the film layer into the nonwoven fabric to be larger than a specific value. SOLUTION: The objective substrate is produced by laminating at least one surface of (A) a nonwoven fabric having an areal density of >=40 g/m<2> and a bulk density of <=0.4 g/cm<3> (e.g. spun-lace type fabric made of rayon, palyolefin or polyester) with (B) a resin film layer (e.g. a layer of polyethylene, ethylene-vinyl acetate copolymer and ethylene-methyl acrylate capolymer) in such a manner as to get the impregnation depth of the component B into the component A to be >=8μm.
申请公布号 JPH1160474(A) 申请公布日期 1999.03.02
申请号 JP19970224874 申请日期 1997.08.21
申请人 SEKISUI CHEM CO LTD 发明人 HATANAKA HIROYUKI
分类号 A61K9/70;B32B5/02;(IPC1-7):A61K9/70 主分类号 A61K9/70
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