Method of cutting semiconductor ingots and apparatus for cutting thereof

摘要

The present invention proposes a method for cutting semiconductor ingots into sliced wafers by use of wire saws, so that the cut-out surface shape of wafers can be easily controlled by utilizing a wire-saw cutting device. The workpiece holding plate 21 is disposed in such a way that it can move along the longitudinal axis Y of the semiconductor ingot 3. The semiconductor ingot 3 is moved downward to facilitate the cutting operation by wire saw. Accordingly, the displacement along the longitudinal axis Y is made to change in response to the variation along the location of the semiconductor ingot 3.