| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing with high efficiency a thin non-contact IC card of high rigidity and high strength to be manufactured at low cost and also provide a method for manufacturing the non-contact IC card with high efficiency. SOLUTION: IC chips 1 and non-contact transmission antenna coils 2 are connected with a metal sheet 3 on which required circuit patterns are formed to manufacture a circuit module 4. Laminate films 6 are bonded on both of surface and back of the circuit module 4 to form a required non-contact IC card. When the IC card is manufacture, the IC chips and antenna coils are mounted respectively on a metal sheet connecting body with a number of metal sheets 3 with required circuit patterns are connected thereon by the given pitch through connecting pieces to manufacture a module connecting body, and laminate film raw fabrics are bonded on both of the surface and back of the circuit module connecting body, and then the module connecting body is cut off on given positions to form required non-contact IC cards in a manufacturing method. |
