SEMICONDUCTOR PACKAGE

摘要

In a semiconductor package comprising a heat spreader, a heat sink, a wiring board, and a connector, a heat spreader is mounted on a remaining regio n of the upper surface of a substrate. The heat sink is thermally connected to a primary integrated circuit chip through the heat spreader, and to a secondary integrated circuit chip. The heat sink has electrical conductivity. The heat sin k comprises a base plate and at least one connecting member which perpendicularly extends from the base plate. The wiring board has a plurality of contact holes a nd a plurality of contact slits. The connector is mounted on the wiring board, and has a plurality of contacts. The contacts are comprised of a plurality of socket por tions and a plurality of terminal portions. The contacts are connected to input/output pins, with the input-output pins inserted into the respective socket portions, and wit h the terminal portions inserted into the respective contact holes. The connector has at least one ground contact. The ground contact comprises a ground socket portion and a ground terminal portion. The at least one ground contact is electrically connected to the at least one connecting member, with the connecting member inserted into the ground socket portion. The ground terminal portions are insert ed into the contact slits.