| 摘要 |
PROBLEM TO BE SOLVED: To carry out resin molding correctly having circuit boards such as BGA boards as articles to be molded. SOLUTION: In the resin mold apparatus, an article 20 to be molded is clamped by molds 12, 16 with a cavity block 10 set independently at each cavity, and resin molding is performed by filling resin in the cavity. In the apparatus a pressing means 30 is provided for supporting movably the cavity block 10 in the mold open and close direction and pressing the cavity block 10 in the mold clamping direction. In addition, a control means is installed for controlling the pressing means 30 in accordance with transfer pressure in the process of filling means in the cavity and thereby effecting clamping force to the article 20 to be molded without creating resin flashes and impairing the article 20 to be molded. |
