发明名称 |
Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate |
摘要 |
A method of controlling shrinkage in aligned green tape stacks during firing comprises providing a topmost layer of a ceramic material having a sintering temperature higher than that of the ceramic used to make the green tapes and firing above the sintering temperature of the green tape ceramic but below the sintering temperature of the topmost layer ceramic. The method of the invention provides improved shrinkage control for green tape stacks on a support substrate.
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申请公布号 |
US5876536(A) |
申请公布日期 |
1999.03.02 |
申请号 |
US19970780243 |
申请日期 |
1997.01.08 |
申请人 |
SARNOFF CORPORATION |
发明人 |
KUMAR, ANANDA HOSAKERE;THALER, BARRY JAY;PRABHU, ASHOK NARAYAN |
分类号 |
H01L21/48;H01L23/15;(IPC1-7):B32B31/26;B32B3/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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