发明名称 Method of finishing board with thick resin film for making under layer invisible
摘要 Thick molded strips of unsaturated polyester resin are bonded to butt edges of a panel member, upper and lower edge portions of the thick molded strips are cut so as to make upper and lower edge surfaces coplanar with upper and lower surfaces of the panel member, the coplanar surface is, thereafter, coated with the unsaturated polyester resin, and the polyester resin film and the thick molded strips are, finally, trimmed with a polisher; even though the molded strips are decreased in thickness through the polishing, the molded strips are thick enough to make the butt edges of the panel invisible, and the appearance of the board member is improved.
申请公布号 US5876543(A) 申请公布日期 1999.03.02
申请号 US19970911176 申请日期 1997.08.14
申请人 YAMAHA CORPORATION 发明人 KINPARA, SHIGERU;OHSUMI, HISAYOSHI;SAGISAKA, YOSHINORI
分类号 B05D7/06;(IPC1-7):B05D1/02;B05D1/04;B29C39/02;B32B31/12 主分类号 B05D7/06
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