| 摘要 |
Process for manufacturing printed-circuit boards with electrical connection between faces. Starting with a board 1 of substrate material with its faces covered on both sides with copper 2, a circuit is defined by means of the partial elimination of the copper by means of chemical etching, the assembly then being punched in order to obtain the holes 5 through which the electrical connection between the two faces of the circuit will be formed, the connection being formed by means of a chemical metallisation phase in which a metallised layer 8 based on a nickel-phosphor alloy is applied to the orifices 5 and to the area surrounding the entrances, the board, after the application of a soldering mask and a mask for identification ink and conducting inks, being suitable for passing through the soldering wave which will fill the metallised holes 5 with a lead/tin mass. <IMAGE>
|
