发明名称 METHOD OF HANDLING CHIP COMPONENT AND ITS DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To make it possible to strip a chip component affixed on the expandable holding sheet having adherend on its surface, while keeping position of each component stable. SOLUTION: There are a plurality of suction grooves 15 and 16 distributed to cover an area opposing to a chip component 12, and a projection 17 positioned between the suction grooves 15 and 16 and partially opposing to each chip component at least at two points. A holding sheet 14 is put on a mounting 11 and negative pressure is applied to the suction grooves 15 and 16. When stripping the holding sheet 14 from the chip component 12 by deforming the holding sheet 14 alongside of the projection 17, a stronger negative pressure applied to the suction groove 15 opposed to a periphery of the chip component 12 makes it possible to strip the holding sheet 14 from the periphery of the chip component 12.</p>
申请公布号 JPH1154594(A) 申请公布日期 1999.02.26
申请号 JP19970210240 申请日期 1997.08.05
申请人 MURATA MFG CO LTD 发明人 YOSHINO TATSUMI;KUGO DAISAKU
分类号 H01L21/67;H01L21/301;H01L21/50;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/67
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