| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board in which the emission of electromagnetic wave from its peripheral sides is suppressed. SOLUTION: In the circuit board, a power source potential layer 12, an interconnecting electrode 32, and a dummy electrode 42 are formed on an FRP substrate 21 which has a ground potential layer 11 on its backside. An interconnecting electrode 32 and the dummy electrode 42 are connected electrically to ground potential layer 11, via an interlayer connecting bump 31a and via a train of shielding bumps 41 formed along the periphery of the wiring plane area of the circuit board, respectively. Signal wirings 13 are formed on a second FRP substrate 22 which is provided above the first FRP substrate 21. Some of the signal wirings 13 are connected electrically to interconnecting electrode 32 via interlayer connecting bumps 31b, and consequently to ground potential layer 11.</p> |
