PRODUCTION OF THIN-FILM MAGNETIC HEAD

摘要

PROBLEM TO BE SOLVED: To obviate the generation of air bubbles and to obtain a smooth resist coating by applying a photoresist on laminated patterns of a specific value or above after application of a solvent thereon at the time of applying the photoreceptor thereon. SOLUTION: The photoresist is applied to the laminated patterns of severalμm or above on a wafer. The solvent used for the photoresist to be applied afterward is applied on a wafer and the wafer is rotated to remove the excess solvent by centrifugal force. The rotation is then stopped. The photoresist dissolved with the solvent is applied on the wafer and the wafer is spinned to get rid of the excessive photoresist. As a result, the solvent remains in the nested fine parts of the patterns and dissolves the photoresist applied afterward to improve the flow. The dissolved photoresist may thus be penetrated and applied to the fine parts. The photoresist is post baked and is cured by heating. The generation of the air bubbles is averted and the occurrence of defective articles is suppressed.