| 摘要 |
PROBLEM TO BE SOLVED: To prevent warp of the resin sealed body of a surface mount resin sealed package by an LOC (leadless on-chip package). SOLUTION: In a semiconductor device 42 of a surface mount resin sealed package, a lead 20 for preventing the warp of a resin sealed body by an LOC is wired in the side part of a chip 24 of the resin sealed body, in parallel with the chip 24. Since the resin sealed body contracts toward the center at the time of thermal hardening, the resin sealed body generates warp on account of difference of the vertical ratio of resin thickness and the vertical structure of resin sealed body inside. But the lead 20 for preventing the warp is in the side part of a chip 24, so that the volume of the side part of the chip 24 of the resin sealed body is vertically divided. In the part of the resin sealed body, generation of warp wherein the upper side expands and the lower side contracts can be prevented. Exfoliation of an outer lead from a land which is to be caused by the warp of the resin sealed body at the time of surface mounting can be prevented. |
