| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size and thickness and to increase the speed of a semiconductor device. SOLUTION: A semiconductor device includes a mother chip 2 having a chip mount surface 2a for supporting semiconductor chips 1, a package substrate 3 that is flip chip connected to the surface 2a, and a sealed portion 5 that is sealed with a sealant, such as an epoxy resin. The two chips 1 and the single substrate 3 are flip chip connected to the surface 2a, so that they are electrically connected to one another. |
