| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor structural member wherein ESD protection is improved without increasing the dimension, cost and complexity of the semiconductor structural member. SOLUTION: A semiconductor structural member 10 contains a substrate 11, doped regions 15, 20 in the substrate 11, mutual connection layers 23, 26, 29 which are connected with one sides of the doped regions, and dielectric layers 21, 24, 27 positioned between the mutual connection layers 23, 26, 29. A part 48 of the uppermost mutual connection layer 29 is positioned above parts 47, 42, 43 of the mutual connection layers 23, 26 positioned below. A part 47 of the central mutual connection layer 26 is not positioned both above the parts 42, 43 of the lowermost mutual connection layer 23 and above one side parts 32, 33 of the doped region 20. |
