| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high frequency multilayered dielectric substrate and a multichip module which are effective in miniaturization and cost reduction of a high frequency device and has the high degree of freedom of connection wiring. SOLUTION: A high frequency multilayered dielectric substrate 1 is provided with a lower side ground electrode 4 on the lower surface of a two-layered substrate constituted of a ceramic layer 2 and a low permitivity layer 3, and a first and a second upper ground electrodes 5 and 6 on the upper surface. Connection wiring is arranged between layers of the two-layered substrates. A multichip module 11 has structure wherein a high frequency circuit chip 12 is loaded on the first upper ground electrode 5, a control circuit chip 13 is loaded on the second upper ground electrode 6, a first connection pad 14 is connected with a connection wiring 7, and a second connection pad 15 is connected with the connection wiring 7. |
