发明名称 CAPILLARY FOR WIRE BONDING
摘要 PROBLEM TO BE SOLVED: To increase and average the resistance force of a wire to an external stress, by making the face angle value of a face in a given direction different from the face angle value in the direction vertical to the given direction. SOLUTION: Bonding is performed to a wire whose lengthwise direction is matched with the direction of ultrasonic vibration, by a face 1a where the minimum face angle α is formed. Bonding is performed to a wire whose lengthwise direction is vertical to the direction of ultrasonic vibration, by a face 1b where the maximum face angle βis formed. On faces except the faces where the maximum face angle and the minimum face angle are formed, face angles which gently change between the minimum and the maximum are formed. Hence, bonding is performed in all directions by a constant force. As a result, the resistance force of a wire to an external stress can be increased and averaged.
申请公布号 JPH1154539(A) 申请公布日期 1999.02.26
申请号 JP19970210801 申请日期 1997.08.05
申请人 SUMITOMO METAL MINING CO LTD 发明人 KATO YUTAKA
分类号 H01L21/60 主分类号 H01L21/60
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