| 摘要 |
PROBLEM TO BE SOLVED: To pattern an electrode thin film while reducing the step coverage of metallic atoms which enter into undercut portions of a pattern, by patterning the electrode thin film on a groove a bottom surface or a stepped bottom surface having a specific depth, at a position distant from the side surface of the groove or the step at least equally to the depth of the groove or the step. SOLUTION: An electrode thin film is patterned on a grooved bottom surface or a stepped bottom surface having a depth of 20-40μm, at a position distant from the side surface of the groove or the step at least equally to the depth of the groove or the step. Specifically, a resist pattern 16' is dissolved in a solvent while simultaneously, and an electrode pattern 18' is formed using a lift-off method for removing a three-layered thin electrode film 18 from the resist pattern 16'. More specifically, a substrate 11 is subjected to ultrasonic cleaning with acetone for 15 minutes, followed by dipping in a given parting liquid for 20 minutes at 100 deg.C. Subsequently, the substrate 11 is cleaned with running pure water, followed by spin drying to pattern the desired electrode pattern 18' at the grooved bottom surface of the substrate 11.
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