| 摘要 |
PROBLEM TO BE SOLVED: To enable automatic supply and ejection of a semiconductor chip, by forming electrically insulating protrusions on a package body, electrically insulation a leadt frame from a semiconductor chip, maintaining a physically fixed state of them, and proceeding with a semiconductor chip assembling process. SOLUTION: After a molding process, tab leads 8, 9 and electrode leads 5, 6 are cut for separation, but protruding leads 1-4 are left. In an electric characteristics selection process and a visual inspection process, a lead frame and an individual semiconductor chip 7 can be in the electrically insulated slate, while they are physically fixed. The semiconductor chip 7 fixed on the lead frame can be adequately carried to an electric signal connection part of an electric characteristics measurement/judgment equipment by a lead frame carriage technique of low cost, be fixed during measurement, and be ejected after measurement is ended. As a result, the handling cost of semiconductor chips can be remarkably reduced. |
