MANUFACTURE OF CERAMIC SUBSTRATE AND ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the filling characteristics of a conductor for opening a hole and to allow dried manufacture by opening a hole through irrading with a laser beam to raw ceramics, and dividing after sintering through defocused state laser light irradiation. SOLUTION: Multiple holes 3 are opened with laser beam 21 on a green ceramics substrate 1, and a conductor 4 is embedded for electrical connection in vertical direction. Then, an interconnection material 5 mounted on the surface is formed by printing on the green ceramics substrate 1. The green ceramics substrates 1 thus produced are piled up in several or tens of sheets for pressurizing, thus forming a laminate 6. After a groove 22 has been formed along a divided line on the laminate 6, it is sintered in a furnace to form a sintered ceramics 7. A condensing laser light 23 whole beam diameter is enlarged is poured along the division line of the sintered ceramics 7, so that cutting under heating stress is performed along the groove 22.