| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting a chip part easily at low cost with high reliability and productivity. SOLUTION: In the method for mounting a chip part (semiconductor laser) 9 on a board 1, solder bumps 2 are provided on the board 1 by punching a solder sheet and a chemically inert liquid 13 is dripped onto the surface of the solder bump 2. Subsequently, a chip side solder joint pad 4 provided on the chip part 9 is brought into contact with the solder bump 2, the chip part 9 is set temporarily on the board 1 and the solder bump 2 in the liquid 13 is thermally fused thus jointing the chip part 9 to the board 1.</p> |
