| 摘要 |
PROBLEM TO BE SOLVED: To allow automatic mounting and to eliminate the need for an attaching hole by providing a supporting stage main body which is formed of thermosetting resin or ceramics into a specified shape in matching with an electronic component, and pasting a thermosetting type bonding agent to one surface which face a wiring substrate or the supporting stage main body. SOLUTION: The shape of a supporting stage main body 2 of an electronic component supporting stage 1 is freely set depending on the shape of the electronic part which is mounted, within a range so as to be accommodated to a chip part mounter. The material of the supporting stage main body 2 is appropriately selected between a thermosetting resin or ceramics. A thermosetting type bonding agent 3 such as a semi-solidified epoxy resin group, etc., is pasted on the bottom surface of the supporting stage main body 2, while the side of thermosetting type bonding agent 3 is pasted to a tape of specified dimension for taping. The taped supporting stage is mounted on a wiring board with the chip part mounter, etc. The wiring board, which the supporting stage 1 is mounted in a reflow process, is heated and soldered, and the thermosetting type bonding agent 3 solidifies, and the supporting stage 1 is bonded and fixed. |
