| 摘要 |
PROBLEM TO BE SOLVED: To suppress deformation of a resin board by placing a resin board comprising an upper wiring layer above bumps penetrating a resin film and providing a via hole metal to penetrate a ceramic substrate. SOLUTION: A resin board 10 provided with an upper wiring layer 26 of a copper foil only on one side thereof is bonded to a ceramic substrate 11 having a via hole metal 12. The upper wiring layer 26 on the surface of the resin board 10 is connected electrically with the via hole metal 12 through silver bumps 22 penetrating a liquid crystal polymer 23. A semiconductor chip 1 is mounted on a central window part of the resin board 10 while touching the ceramic substrate 11 directly. According to the structure, the upper wiring layer 26 facing the ceramic substrate 11 through the resin board 10 can be protected against troubles, e.g. deformation, open circuits or short-circuiting, even if the resin board 10 is made thin. |
