| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which forms fine-diameter via-holes, using a conformal mask. SOLUTION: Using an electroless plating film 30 as a conformal mask, openings 26 for via-holes are formed using a laser. An electrolytic plating layer 44 is provided on an electroless plating layer 40. For forming a conductor circuit 46 and via-holes 48, the plating layers 30, 40 at a resin 38 lower layer are etched off. Both layers 30, 40 are thin films deposited by the electroless plating enough to easily remove. For etching, the layer 44 for forming the conductor circuit 46 and via-holes 48 is never corroded. Thus, it is possible to form a fine-pitch wiring and fine-diameter via-holes. |
