MANUFACTURE OF PRINT WIRING BOARD FOR SEMICONDUCTOR CHIP CONNECTION

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a printed wiring board for semiconductor chip connection, used in area array package, to form an insulating film having superior reliability and processibility in input/output terminal wiring portions. SOLUTION: When forming a polyimide insulating film 4 in an input/output terminal wiring portions 3 of a printed wiring board A for connection of a semiconductor chip 1, the method comprises steps of attaching a polyimide precursor resin film B having at least a polyimide precursor resin layer to the wiring board A, patterning the polyimide precursor resin layer with photosensitive resin, and performing heat processing. A photosensitive polyimide precursor resin film, where a polyimide precursor resin layer and a photosensitive resin layer are formed sequentially, is used as the polyimide precursor resin film B.