| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to achieve the thin configuration regardless of the magnitude of a semiconductor device. SOLUTION: Thermosetting resin 10 is applied on the tip part of a suspension lead 2. A spherical filler 11 having the constant diameter is mixed into the thermosetting resin 10. Thus, the thickness of a junction part is controlled to 1/2-1/10 of the thickness of the lead, and the stabilized junction thickness can be realized. In this way, the balance of sealing resin 7a at the lower surface of a semiconductor 4 and sealing resin 7b at the upper surface can be maintained, and the fluidity of the sealing resin 7 in molding can be improved. Furthermore, the tip part 2a of the suspension lead 2 has a half-etched part 12. This is the surface mounting type semiconductor device, which does not indicate any difference from the shapes of the suspension lead 2 and an outer lead 8 exposing on the bottom surface part of a conventional plastic molded type semiconductor device.</p> |
