HALBLEITER MIT EINEM TRÄGER AUF DEM EIN SUBSTRAT MIT EINEM HALBLEITER-ELEMENT MITTELS EINER KLEBESCHICHT UND EIN LEITERBAHN-MUSTER BEFESTIGT SIND

摘要

A semiconductor device with a carrier body on which a substrate is fastened by means of a glue layer, which substrate is provided at its first side facing the carrier body with a semiconductor element and with a pattern of conductor tracks comprising contact electrodes for external contacting from the second side of the substrate facing away from the carrier body. The substrate is provided with windows at the areas of the contact electrodes for external contacting from the second side. The process steps preceding the gluing of the substrate to the carrier body are carried out in a clean room suitable for the manufacture of semiconductor elements, whereas the remaining process steps are preferably carried out in a final mounting room. Expensive lithographical equipment need not be available in both rooms, because the comparatively large windows can be formed by means of a simple contact mask.