| 摘要 |
<p>The present invention relates to a cleaning solution for cleaning substrates, to which a metallic wiring has been applied, being capable of easily removing the metallic impurities of the substrate surface without corroding the metal, not putting a strain on the environment, and not causing a shelf life problem. The cleaning solution comprising at least one member selected from a group consisting of oxalic acid, ammonium oxalate and polyaminocarboxylic acids, but contains no hydrogen fluoride.</p> |
