| 摘要 |
<p>The printed circuit assembly (PCA) having improved reference plane isolation for reducing electromagnetic and communication Input/Output (I/O) emissions includes a reference plane layer having a number of apertures patterned in it, and a component layer of the PCA I/O communication circuitry and non I/O circuitry on it. Preferably, the apertures are aligned in a double row of single file patterns on the reference plane. The single file patterns are positioned parallel to and adjacent each other. Also, each aperture in each single file pattern is offset staggered w.r.t. a corresponding aperture in the adjacent single file pattern. When the reference plane layer and component layer are disposed in the PCA, the patterned apertures are placed relative to the component layer in a manner such that they separate the non I/O circuitry from the I/O communication circuitry for reducing I/O communication emissions. Alternatively, the apertures are aligned in an individual, single file pattern on the reference plane.</p> |
