发明名称 |
Semiconductor device comprising a wiring substrate |
摘要 |
A copper sheet 6 having an aperture provided therein at a bonding area for clearing the semiconductor chip 4 and its bonding wires 5 is bonded by an adhesive 3 to a sealing side of an organic substrate 1 which has been loaded on the sealing side with a pattern of copper foil wiring 2. The copper sheet 6 is higher in the adhesivity to a sealing resin 7 than any conventional resist. A resultant semiconductor device according to the present invention will prevent detachment of the sealing resin at interface which may result from a thermal history in the sealing or reflow process and eliminate entrance of water hence minimizing declination in the resistance to moisture. <IMAGE> |
申请公布号 |
EP0863549(A3) |
申请公布日期 |
1999.02.24 |
申请号 |
EP19970310366 |
申请日期 |
1997.12.19 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TERUI, MAKOTO |
分类号 |
H01L23/28;H01L21/52;H01L21/60;H01L23/31;H01L23/498 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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