发明名称 POLISHING TOOL TO FLATTEN SUBSTRATE AND POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing tool capable of deforming after camber of an overall surface of a substrate of a large area, selectively working on a small protruded part with strong pressure contact force without copying small irregularities on the substrate, having necessary surface hardness and permitting little scratch. SOLUTION: A polishing tool 1 to polish a substrate 7 of a large area flat is constituted by laminating and adhering an extreme inner layer 2 of an elastic body of the softest suede type nonwoven fabric, of three layers; an intermediate layer 3 of an elastic body of the hardest hard urethane resin sheet of the three layers; and a surface layer 4 of a porous resin sheet softer than the intermediate layer 3 and harder than the extreme inner layer 2 and by dividing at least the intermediate layer 3 of the three layers into segments. It can deform after camber of an overall surface of the substrate 7, and the hard intermediate layer 3 divided into segments or the intermediate layer 3 divided into segments and the surface layer 4 preferentially and selectively polish(es) and remove(s) a small protruded part produced in correspondence with a wiring on a surface of the substrate by strongly pressure contacting with it.
申请公布号 JPH1148131(A) 申请公布日期 1999.02.23
申请号 JP19970219234 申请日期 1997.07.30
申请人 CANON INC 发明人 TAKASHITA JUNJI
分类号 B24B37/20;B24B37/22;B24B37/24;H01L21/304 主分类号 B24B37/20
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