| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for grinding and polishing a sphere with high grinding and polishing efficiency, and suitable for relatively easy production of the sphere of high sphericity. SOLUTION: This device is provided with a freely rotating and vertically movable rotary shaft 7 with a passing groove for a worked sphere formed into a spiral shape in its periphery, and a housing 11 arranged in an outer periphery of the shaft 7 and having a grinding and polishing surface in its inner surface. An outer circumferential surface of a sphere is ground and polished into a sphere of high sphericity during a period when the worked sphere is rotatingly moved through the passing groove 6 formed into the spiral shape in the outer periphery of the rotary shaft 7 while contacting with an inner surface of the housing 11 for grinding and polishing. This device is applicable not only for a semiconductor silicon sphere as the worked sphere but also for a steel sphere, ceramic sphere and resin sphere, the worked sphere having sizes of about 0.1 mm-10 mm can be ground and polished with high sphericity, and high sphericity within±0.2μm of a roundness error is attained in the case of a sphere of 1 mm diameter. |
