| 摘要 |
PROBLEM TO BE SOLVED: To enable strong bonding of a transparent conductive thin film layer and an ultraviolet light hardening resin. SOLUTION: On a transparent conductive thin film layer mainly composed of an indium oxide formed on a high-molecular molding base, a dielectric layer of 2 or higher relative dielectric constant is formed. In a method for bonding a transparent conductive laminate, which is formed by applying and hardening an ultra violet light hardening resin on the dielectric layer, and the transparent conductive thin film layer, the dielectric layer having 2 or higher relative dielectric constant is formed between the transparent conductive thin film layer and the ultra violet light hardening resin.
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