发明名称 RESIN COMPOSITION AND CONDUCTIVE FILM
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition whose conductivity (surface conductivity) is optionally controllable by blending a conductive metal oxide and a hygroscopic compound into the composition. SOLUTION: As a conductive metal oxide, a zinc antimonate, a tin oxide doped with antimony, an indium oxide or the like can be used and a zinc antimonate anhydride sol whose primary particle diameter is usually not more than 0.5μm is preferable. The content is preferably 30-70 wt.% as a solid component in the nonvolatile component of the resin composition. A hygroscopic compound has a characteristics to absorb (adsorb) water in the air and preferably is soluble to water and monatomic alcoholes such as methanol, isopropanol and the like. A water soluble alkali metal salt, a water soluble alkaline earth metal salt, a water soluble alcohol having 3 or more hydroxide groups in the molecule and a water soluble amine derivative having 2 or more amino groups in the molecule can be used as the hygroscopic compound. As a resin, an ultraviolet curing resin which is a polymerizing resin is preferably used.
申请公布号 JPH1149965(A) 申请公布日期 1999.02.23
申请号 JP19970222086 申请日期 1997.08.05
申请人 NIPPON KAYAKU CO LTD 发明人 KANEKO KATSUICHI;ITO YUJI;SAKURAI HIROSHI;EMORI HIROYUKI;TAKAHASHI TAKESHI
分类号 B32B7/02;C08F299/00;C08J7/04;C08K3/22;C08K3/24;C08K5/053;C08K5/17;C08L101/00;C09D5/00;C09D5/24;(IPC1-7):C08L101/00 主分类号 B32B7/02
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