发明名称 Embedded power and ground plane structure
摘要 A device architecture with embedded planar conductive ground and power planes in the device architecture. The apparatus includes a first conductive plane, a second conductive plane, a signal plane disposed between the first and second conductive planes, and a logic level disposed adjacent the first conductive plane and connected to the signal plane through at least one via in the conductive plane. The apparatus also includes a built-in alignment scheme. The invention includes a method for making the device and alignment architectures.
申请公布号 US5874778(A) 申请公布日期 1999.02.23
申请号 US19970873102 申请日期 1997.06.11
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BHATTACHARYYA, ARUP;LEIDY, ROBERT K.
分类号 H01L23/52;H01L21/3205;H01L23/528;(IPC1-7):H01L23/48 主分类号 H01L23/52
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