发明名称 |
Embedded power and ground plane structure |
摘要 |
A device architecture with embedded planar conductive ground and power planes in the device architecture. The apparatus includes a first conductive plane, a second conductive plane, a signal plane disposed between the first and second conductive planes, and a logic level disposed adjacent the first conductive plane and connected to the signal plane through at least one via in the conductive plane. The apparatus also includes a built-in alignment scheme. The invention includes a method for making the device and alignment architectures. |
申请公布号 |
US5874778(A) |
申请公布日期 |
1999.02.23 |
申请号 |
US19970873102 |
申请日期 |
1997.06.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BHATTACHARYYA, ARUP;LEIDY, ROBERT K. |
分类号 |
H01L23/52;H01L21/3205;H01L23/528;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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