| 发明名称 |
Radiant polishing block heater |
| 摘要 |
<p>A method for mounting a semiconductor wafer on a polishing block (B) to hold the semiconductor wafer during polishing. The method comprises the steps of providing a polishing block (B) having a surface for mounting the semiconductor wafer, coating the polishing block surface with a bonding agent, applying radiant heat to the polishing block (B) and bonding agent to soften the bonding agent, and applying the semiconductor wafer to the softened bonding agent. The step of applying radiant heat to the polishing block and bonding agent is performed by a radiant heater (32) in a dry environment. <IMAGE></p> |
| 申请公布号 |
SG60059(A1) |
申请公布日期 |
1999.02.22 |
| 申请号 |
SG19970001351 |
申请日期 |
1997.04.29 |
| 申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
HARRIS, DARREL, M.;HALL, HAROLD, E. |
| 分类号 |
H01L21/683;B24B37/015;B24B37/34;B24B49/14;H01L21/304;H01L21/306;(IPC1-7):H01L21/00;H01L21/302;B24B37/04 |
主分类号 |
H01L21/683 |
| 代理机构 |
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