Method and device for removing a semiconductor wafer from a flat substrate

摘要

The method involves forcing a fluid (15) through the base (1) against the semiconductor disc (5) lying on it. The fluid acts on the disc to lift it from the base and it is then removed by a pickup device. The semiconductor disc can be rinsed to remove the fluid in a collecting container preventing the disc from falling back on to the base. The process of raising and rinsing the disc can be automated. The pickup tool can contact the disc at its edge or the disc can be picked up by a suction tool