LEAD ON CHIP PACKAGE,申请号KR19950042877U-传众专利搜索

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发明名称	LEAD ON CHIP PACKAGE
摘要
申请公布号	KR0135890(Y1)	申请公布日期	1999.02.18
申请号	KR19950042877U	申请日期	1995.12.18
申请人	HYUNDAI ELECTRONICS IND. CO.,LTD	发明人	KO, KYUNG-HEE
分类号	H01L23/04;(IPC1-7):H01L23/04	主分类号	H01L23/04
代理机构		代理人
主权项
地址

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