发明名称 IMPROVED POLISHING PADS AND METHODS RELATING THERETO
摘要 <p>Polishing pads are provided having a polishing surface formed from a hydrophilic material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.</p>
申请公布号 WO1999007515(A1) 申请公布日期 1999.02.18
申请号 US1998016289 申请日期 1998.08.05
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