发明名称 |
MOUNTING STRUCTURE AND MOUNTING PROCESS FROM SEMICONDUCTOR DEVICES |
摘要 |
The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be securely fixed to a circuit board by short-time heat curing, which exhibits good productivity, and excellent heat shock properties (or thermal cycle properties), and which permits the semiconductor device to be easily removed from the circuit board in the event of failure. This invention also provides a mounting process for semiconductor devices. |
申请公布号 |
WO9832159(A3) |
申请公布日期 |
1999.02.18 |
申请号 |
WO1998US00856 |
申请日期 |
1998.01.16 |
申请人 |
LOCTITE CORPORATION;MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;IIDA, KAZUTOSHI;WIGHAM, JON;WATANABE, MASAKI;MEGURO, TAKESHI |
发明人 |
IIDA, KAZUTOSHI;WIGHAM, JON;WATANABE, MASAKI;MEGURO, TAKESHI |
分类号 |
C08G59/24;H01L21/56;H01L21/60;H01L23/29;H01L23/31;H05K3/28;H05K3/34 |
主分类号 |
C08G59/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|