MOLD USED FOR SEMICONDUCTOR PACKAGE FORMING,申请号KR19950001762U-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MOLD USED FOR SEMICONDUCTOR PACKAGE FORMING
摘要
申请公布号	KR0122888(Y1)	申请公布日期	1999.02.18
申请号	KR19950001762U	申请日期	1995.02.07
申请人	HANMI CO.,LTD	发明人	KWAK, NOH-KWAN
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Improvements in and relating to barrows

Improvements in and relating to rubber proofed material and articles made thereof such as aprons and bed sheeting, and the manufacture thereof

Improvements in or relating to gas masks

A process for the separation of nickel salts from solutions containing other heavy metals

Perfectionnements aux filtres

Improved means for controlling the timing and sequence of operations

Perforiermaschine

Appareil téléphonique à paiement préalable

Perfectionnements aux bougies d'allumage

Levier de manceuvre d'aiguilles à rappel élastique

Improvements in and relating to radio-controlled devices

Improvements in the conversion of constituents of carob beans

Improvements relating to sound producing apparatus

Improvements in or relating to forehearths for molten glass

An improved method of dressing floury stocks

Improvements in or relating to non-return valves

Improvements in and relating to clothes wringing machines

Improved device for the mechanical determination of firing data for firing at movingtargets

Improvements in metal vapour electric converters