| 发明名称 |
METHOD AND APPARATUS FOR DETECTING BALL AT WIRE BONDING PART |
| 摘要 |
A method and apparatus for determining the position, size and/or shape of a ball formed on a pad of a semiconductor chip when a wire is bonded between the pad and a lead of a lead frame. The ball is detected in at least three directions from the center of the ball towards the edge of the ball. |
| 申请公布号 |
KR0169845(B1) |
申请公布日期 |
1999.02.18 |
| 申请号 |
KR19950020285 |
申请日期 |
1995.07.11 |
| 申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
YAMAZAKI, NOBUTO;OGATA, YOSHIYUKI |
| 分类号 |
H01L21/60;G06K9/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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