CUTTING DEVICE OF SEMICONDUCTOR WAFER,申请号KR19950010598U-传众专利搜索

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发明名称	CUTTING DEVICE OF SEMICONDUCTOR WAFER
摘要
申请公布号	KR0123470(Y1)	申请公布日期	1999.02.18
申请号	KR19950010598U	申请日期	1995.05.18
申请人	HYUNDAI ELECTRONICS IND. CO.,LTD	发明人	KIM, KANG-SANG
分类号	H01L21/78;(IPC1-7):H01L21/78	主分类号	H01L21/78
代理机构		代理人
主权项
地址

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