| 摘要 |
PROBLEM TO BE SOLVED: To suppress the wiring resistance from rising and easily bond, by mounting a semiconductor element on a lead frame by the wireless bonding through bond zones formed from a bond layer and protrusions formed at lead tops. SOLUTION: Bond zones 3 for contacting the electrodes of a semiconductor element 1 are formed at the tops of leads 2a of a lead frame having no island. Each bond zone 3 is composed of protrusions 3a formed by cutting the lead tops and partly plated thin bond layers 3b formed on the protrusions. The electrode of the semiconductor element 1 is directly bonded to each bond layer 3b, and the element 1 is mounted on the lead frame by the wireless bonding. The protrusions 3b ensure spaces for blocking the element 1 from contacting leads through the bond zone 3 at other part than the bond zone. |
